Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Yeonho Jang, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Jongyoun Kim, Yeonho Jang | 2021-08-17 |
| 11075149 | Redistribution substrate, method of manufacturing the same, and semiconductor package including the same | — | 2021-07-27 |
| 11056461 | Method of manufacturing fan-out wafer level package | Yeonho Jang, Gwangjae Jeon, Dongkyu Kim, Jungho Park | 2021-07-06 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2021-05-25 |
| 10964643 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2021-03-30 |
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2021-03-16 |
| 10930625 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2021-02-23 |
| 10923407 | Semiconductor device | Sundae KIM, Yun-Rae Cho, Namgyu Baek | 2021-02-16 |