Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056461 | Method of manufacturing fan-out wafer level package | Yeonho Jang, Dongkyu Kim, Jungho Park, Seokhyun Lee | 2021-07-06 |
GJ
Gwangjae Jeon
Overall (2021): #442,256 of 548,734Top 85%
1
Patents 2021