Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Jongyoun Kim, Seokhyun Lee | 2021-08-17 |
| 11056461 | Method of manufacturing fan-out wafer level package | Gwangjae Jeon, Dongkyu Kim, Jungho Park, Seokhyun Lee | 2021-07-06 |