Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145611 | Semiconductor package and method of manufacturing the same | Jungho Park, Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Seokhyun Lee, Yeonho Jang | 2021-08-17 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2021-05-25 |
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2021-03-16 |