Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2021-03-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2021-03-16 |