Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2021-03-16 |
MB
Minjun Bae
Overall (2021): #336,396 of 548,734Top 65%
1
Patents 2021