Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177205 | Semiconductor package having multi-level and multi-directional shape narrowing vias | Jung-Ho Park, Jong Youn Kim | 2021-11-16 |
MB
Min Jun Bae
Overall (2021): #336,397 of 548,734Top 65%
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Patents 2021