Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101231 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Seok Hyun LEE, Kyoung Lim Suk, Seok-Won Lee | 2021-08-24 |
| 11018108 | Method of fabricating semiconductor package | Seokhyun Lee, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2021-05-25 |