Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152309 | Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structure | — | 2021-10-19 |
| 11107700 | Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure | — | 2021-08-31 |
| 11101231 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Seok Hyun LEE, Youn-ji Min, Seok-Won Lee | 2021-08-24 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Jongyoun Kim, Seokwon Lee | 2021-05-25 |
| 10964643 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2021-03-30 |
| 10930625 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2021-02-23 |