Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Yeonho Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Inwon O, Jongyoun Kim, Seokhyun Lee, Yeonho Jang | 2021-08-17 |