Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121064 | Semiconductor package | Jung-Ho Park, Da Hye Kim, Jin-Woo Park | 2021-09-14 |
| 10923650 | Magneto-resistive chip package including shielding structure | Baik Woo Lee, Young Jae Kim | 2021-02-16 |