Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081424 | Micro-fluidic channels having various critical dimensions | Kamal K. Sikka, Joshua M. Rubin, Iqbal Rashid Saraf, Fee Li Lie | 2021-08-03 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Mukta G. Farooq, Dinesh Gupta, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin | 2021-06-29 |
| 10991635 | Multiple chip bridge connector | Dale Curtis McHerron, Kamal K. Sikka, Joshua M. Rubin, Ramachandra Divakaruni, William J. Starke +1 more | 2021-04-27 |
| 10943883 | Planar wafer level fan-out of multi-chip modules having different size chips | Mukta G. Farooq, Dinesh Gupta, James J. Kelly | 2021-03-09 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2021-03-02 |