Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11074387 | Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance | Michael Rizzolo, Chih-Chao Yang | 2021-07-27 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more | 2021-04-13 |
| 10978388 | Skip via for metal interconnects | Hari Prasad Amanapu, Nicholas V. LiCausi, Lars Liebmann, James Jay McMahon, Cornelius Brown Peethala +1 more | 2021-04-13 |