Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177144 | Wafer spot heating with beam width modulation | Shu-Kwan LAU, Zhiyuan Ye, Zuoming ZHU, Koji Nakanishi, Toshiyuki Nakagawa +1 more | 2021-11-16 |
| 11171023 | Diode laser for wafer heating for EPI processes | Schubert S. Chu, Douglas E. Holmgren, Kartik Shah, Palamurali GAJENDRA, Preetham Rao +5 more | 2021-11-09 |
| 11021790 | Liner for processing chamber | Zhepeng CONG, Schubert S. Chu, Kartik Shah, Surajit Kumar | 2021-06-01 |
| 11021795 | Multi zone spot heating in epi | Shu-Kwan LAU, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming ZHU, Zhiyuan Ye +3 more | 2021-06-01 |
| 10930543 | Thermal processing susceptor | Anhthu Ngo, Zuoming ZHU, Balasubramanian Ramachandran, Paul Brillhart, Edric Tong +10 more | 2021-02-23 |