Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211714 | Slot antenna on a printed circuit board (PCB) | Eng Huat Goh, Min Suet Lim, Boon Ping Koh, Wil Choon Song | 2021-12-28 |
| 11178768 | Flexible printed circuit EMI enclosure | Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh, Eng Huat Goh | 2021-11-16 |
| 11177226 | Flexible shield for semiconductor devices | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Min Suet Lim | 2021-11-16 |
| 11153968 | Device, system and method to promote the integrity of signal communications | Jackson Chung Peng Kong, Bok Eng Cheah, Yun Ling, Chia Voon Tan | 2021-10-19 |
| 11114421 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Ping Ping Ooi | 2021-09-07 |
| 11061492 | Gyratory sensing system to enhance wearable device user experience via HMI extension | Wil Choon Song, Howard L. Heck, Su Sin Florence Phun | 2021-07-13 |
| 10996773 | Gyratory sensing system to enhance wearable device user experience via HMI extension | Wil Choon Song, Howard L. Heck, Su Sin Florence Phun | 2021-05-04 |
| 10971440 | Semiconductor package having an impedance-boosting channel | Bok Eng Cheah, Jackson Chung Peng Kong, Po Yin Yaw, Kok Hou TEH | 2021-04-06 |
| 10973116 | 3D high-inductive ground plane for crosstalk reduction | Jackson Chung Peng Kong, Bok Eng Cheah, Ramaswamy Parthasarathy | 2021-04-06 |