Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11146003 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2021-10-12 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Jeffrey A. Zitz | 2021-04-13 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2021-01-12 |