Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand +2 more | 2021-12-28 |
| 11146003 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Hilton T. Toy | 2021-10-12 |
| 10969222 | Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect | Elaine Cyr, Dominique L. Demers, Alexander Janta-Polczynski | 2021-04-06 |