Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171204 | High thermal budget compatible punch through stop integration using doped glass | Kangguo Cheng, Xin Miao, Chun-Chen Yeh | 2021-11-09 |
| 11152460 | High thermal budget compatible punch through stop integration using doped glass | Kangguo Cheng, Xin Miao, Chun-Chen Yeh | 2021-10-19 |
| 10892339 | Gate first technique in vertical transport FET using doped silicon gates with silicide | Ruqiang Bao, Hemanth Jagannathan, Paul C. Jamison, Choonghyun Lee, Vijay Narayanan | 2021-01-12 |