Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177128 | Apparatus and methods for manufacturing semiconductor structures using protective barrier layer | Pramit Manna, Abhijit Basu Mallick, Kurtis Leschkies, Shishi Jiang | 2021-11-16 |
| 11133174 | Reduced volume processing chamber | Roman Gouk, Han-Wen Chen, Jean Delmas | 2021-09-28 |
| 11063169 | Substrate structuring methods | Han-Wen Chen, Giback Park | 2021-07-13 |
| 11018032 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2021-05-25 |
| 11011392 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures | Han-Wen Chen, Roman Gouk | 2021-05-18 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2021-03-02 |
| 10886232 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2021-01-05 |