Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063169 | Substrate structuring methods | Han-Wen Chen, Steven Verhaverbeke | 2021-07-13 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2021-03-02 |
| 10886232 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2021-01-05 |