Issued Patents 2020
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879235 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Neng-Kuo Chen | 2020-12-29 |
| 10879065 | III-V compound semiconductors in isolation regions and method forming same | Chih-Hsin Ko, Cheng-Hsien Wu | 2020-12-29 |
| 10854708 | Capacitor having multiple graphene structures | Chewn-Pu Jou, Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu +3 more | 2020-12-01 |
| 10847636 | Methods for forming semiconductor structure | Chun Hsiung Tsai, Ru-Shang Hsiao | 2020-11-24 |
| 10804163 | Method of metal gate formation and structures formed by the same | Yi-Jing Lee, Ya-Yun Cheng, Hau-Yu Lin, I-Sheng Chen, Chia-Ming Hsu +1 more | 2020-10-13 |
| 10797156 | Method of forming the gate electrode of field effect transistor | Neng-Kuo Chen, Yi-An Lin, Chun-Wei Chang, Sey-Ping Sun | 2020-10-06 |
| 10797162 | FinFET device having a channel defined in a diamond-like shape semiconductor structure | You-Ru Lin, Cheng-Hsien Wu, Chih-Hsin Ko | 2020-10-06 |
| 10734411 | Systems and methods for a semiconductor structure having multiple semiconductor-device layers | Yi-Tang Lin, Chun Hsiung Tsai | 2020-08-04 |
| 10727351 | Semiconductor structures and methods with high mobility and high energy bandgap materials | Cheng-Hsien Wu, Chih-Hsin Ko | 2020-07-28 |
| 10665674 | FinFET semiconductor device with germanium diffusion over silicon fins | Yi-Jing Lee, Cheng-Hsien Wu, Chih-Hsin Ko | 2020-05-26 |
| 10651091 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin +5 more | 2020-05-12 |
| 10622261 | FinFET devices with unique shape and the fabrication thereof | Yi-Jing Lee, Cheng-Hsien Wu, Chih-Hsin Ko | 2020-04-14 |
| 10535573 | System and method for test key characterizing wafer processing state | Ling-Yen Yeh, Chi-Yuan Shih, Wei-Chun Tsai | 2020-01-14 |