Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879235 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Clement Hsingjen Wann | 2020-12-29 |
| 10797156 | Method of forming the gate electrode of field effect transistor | Clement Hsingjen Wann, Yi-An Lin, Chun-Wei Chang, Sey-Ping Sun | 2020-10-06 |
| 10651091 | Wrap-around contact on FinFET | Sung-Li Wang, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang +5 more | 2020-05-12 |