Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879235 | Inter-level connection for multi-layer structures | Clement Hsingjen Wann, Neng-Kuo Chen | 2020-12-29 |
| 10734411 | Systems and methods for a semiconductor structure having multiple semiconductor-device layers | Chun Hsiung Tsai, Clement Hsingjen Wann | 2020-08-04 |
| 10573751 | Structure and method for providing line end extensions for fin-type active regions | Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang +2 more | 2020-02-25 |