Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825786 | Polymer resin and compression mold chip scale package | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2020-11-03 |
| 10748850 | Thinned semiconductor package and related methods | Takashi Noma, Francis J. Carney | 2020-08-18 |
| 10700018 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Chee Hiong CHEW, Swee Har KHOR | 2020-06-30 |
| 10700027 | Semiconductor copper metallization structure and related methods | — | 2020-06-30 |
| 10693270 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-06-23 |
| 10651124 | Semiconductor package and related methods | Yenting Wen, George Chang | 2020-05-12 |
| 10607903 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2020-03-31 |
| 10600736 | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods | Takashi Noma, Shinzo Ishibe | 2020-03-24 |