| 10861775 |
Connecting clip design for pressure sintering |
Atapol Prajuckamol, Yushuang YAO |
2020-12-08 |
| 10861767 |
Package structure with multiple substrates |
Atapol Prajuckamol, Yushuang YAO |
2020-12-08 |
| 10825786 |
Polymer resin and compression mold chip scale package |
Yusheng LIN, Soon Wei WANG, Francis J. Carney |
2020-11-03 |
| 10825748 |
Semiconductor package system and related methods |
Yushuang YAO, Atapol Prajuckamol |
2020-11-03 |
| 10756006 |
Leadless semiconductor packages, leadframes therefor, and methods of making |
Darrell D. Truhitte, Soon Wei WANG |
2020-08-25 |
| 10727170 |
Semiconductor devices and methods of making the same |
Swee Har KHOR, Tian Hing Lim, Hui Min LER, Phillip Celaya |
2020-07-28 |
| 10720725 |
Flexible press fit pins for semiconductor packages and related methods |
Yushuang YAO, Atapol Prajuckamol |
2020-07-21 |
| 10700018 |
Reinforced semiconductor die and related methods |
Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR |
2020-06-30 |
| 10693270 |
Press-fit pin for semiconductor packages and related methods |
Atapol Prajuckamol, Yusheng LIN |
2020-06-23 |
| 10607903 |
Semiconductor package with elastic coupler and related methods |
Yusheng LIN, Francis J. Carney |
2020-03-31 |
| 10559510 |
Molded wafer level packaging |
Soon Wei WANG, Jin Yoong LIONG, Francis J. Carney |
2020-02-11 |
| 10559905 |
Flexible press fit pins for semiconductor packages and related methods |
Yushuang YAO, Atapol Prajuckamol |
2020-02-11 |