Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770332 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-09-08 |
| 10770333 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-09-08 |
| 10756006 | Leadless semiconductor packages, leadframes therefor, and methods of making | Soon Wei WANG, Chee Hiong CHEW | 2020-08-25 |
| 10707111 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-07-07 |
| 10529632 | Damaging components with defective electrical couplings | James P. Letterman, Jr. | 2020-01-07 |