Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825754 | Quad flat no leads package with locking feature | How Kiat Liew, Jose Felixminia PALAGUD, JR. | 2020-11-03 |
| 10825786 | Polymer resin and compression mold chip scale package | Yusheng LIN, Chee Hiong CHEW, Francis J. Carney | 2020-11-03 |
| 10756006 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2020-08-25 |
| 10607920 | Semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10607921 | Method for forming a semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10559510 | Molded wafer level packaging | Jin Yoong LIONG, Chee Hiong CHEW, Francis J. Carney | 2020-02-11 |