Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825754 | Quad flat no leads package with locking feature | Soon Wei WANG, Jose Felixminia PALAGUD, JR. | 2020-11-03 |
| 10763173 | Thin semiconductor package and related methods | Shutesh Krishnan, Sw Wang, CH CHEW, Fui Fui Tan | 2020-09-01 |