Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763173 | Thin semiconductor package and related methods | Shutesh Krishnan, CH CHEW, How Kiat Liew, Fui Fui Tan | 2020-09-01 |
| 10699989 | Semiconductor package with grounding device and related methods | Atapol Prajuckamol, Kai Chat Tan | 2020-06-30 |