Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861775 | Connecting clip design for pressure sintering | Chee Hiong CHEW, Yushuang YAO | 2020-12-08 |
| 10861767 | Package structure with multiple substrates | Chee Hiong CHEW, Yushuang YAO | 2020-12-08 |
| 10825748 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-11-03 |
| 10720725 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-07-21 |
| 10699989 | Semiconductor package with grounding device and related methods | Sw Wang, Kai Chat Tan | 2020-06-30 |
| 10693270 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Yusheng LIN | 2020-06-23 |
| 10607921 | Method for forming a semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10607920 | Semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10559905 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-02-11 |