Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861767 | Package structure with multiple substrates | Atapol Prajuckamol, Chee Hiong CHEW | 2020-12-08 |
| 10861775 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Chee Hiong CHEW | 2020-12-08 |
| 10825748 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-11-03 |
| 10720725 | Flexible press fit pins for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-07-21 |
| 10559905 | Flexible press fit pins for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-02-11 |