Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825786 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2020-11-03 |
| 10825764 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2020-11-03 |
| 10818587 | Semiconductor device and method of forming a curved image sensor | Michael J. Seddon, Eric Woolsey | 2020-10-27 |
| 10748850 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2020-08-18 |
| 10741484 | Stacked semiconductor device structure and method | Michael J. Seddon | 2020-08-11 |
| 10607903 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2020-03-31 |
| 10559510 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Chee Hiong CHEW | 2020-02-11 |