| 10825725 |
Backside metal patterning die singulation systems and related methods |
— |
2020-11-03 |
| 10825764 |
Semiconductor device and method of forming micro interconnect structures |
Francis J. Carney, Jefferson W. Hall |
2020-11-03 |
| 10825731 |
Methods of aligning a semiconductor wafer for singulation |
Takashi Noma |
2020-11-03 |
| 10818551 |
Plasma die singulation systems and related methods |
— |
2020-10-27 |
| 10818587 |
Semiconductor device and method of forming a curved image sensor |
Francis J. Carney, Eric Woolsey |
2020-10-27 |
| 10811598 |
Current sensor packages |
Jefferson W. Hall, Yenting Wen |
2020-10-20 |
| 10796963 |
Backside metal patterning die singulation systems and related methods |
— |
2020-10-06 |
| 10777509 |
Methods of reducing wafer thickness |
— |
2020-09-15 |
| 10770351 |
Semiconductor substrate production systems and related methods |
— |
2020-09-08 |
| 10755956 |
Backside wafer alignment methods |
Takashi Noma |
2020-08-25 |
| 10741487 |
SOI substrate and related methods |
Mark Griswold |
2020-08-11 |
| 10741484 |
Stacked semiconductor device structure and method |
Francis J. Carney |
2020-08-11 |
| 10685891 |
Semicoductor wafer and method of backside probe testing through opening in film frame |
Heng Chen Lee |
2020-06-16 |
| 10685863 |
Wafer thinning systems and related methods |
— |
2020-06-16 |
| 10679898 |
Semiconductor substrate die sawing singulation systems and methods |
— |
2020-06-09 |
| 10665458 |
Semiconductor wafer thinning systems and related methods |
Thomas Neyer |
2020-05-26 |
| 10615127 |
Thinned semiconductor wafer |
— |
2020-04-07 |
| 10607889 |
Jet ablation die singulation systems and related methods |
— |
2020-03-31 |
| 10589989 |
Absolute and differential pressure sensors and related methods |
— |
2020-03-17 |
| 10593602 |
Semiconductor substrate crack mitigation systems and related methods |
— |
2020-03-17 |
| 10573803 |
Current sensor packages with through hole in semiconductor |
Jefferson W. Hall, Yenting Wen |
2020-02-25 |