Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825731 | Methods of aligning a semiconductor wafer for singulation | Michael J. Seddon | 2020-11-03 |
| 10755956 | Backside wafer alignment methods | Michael J. Seddon | 2020-08-25 |
| 10748850 | Thinned semiconductor package and related methods | Yusheng LIN, Francis J. Carney | 2020-08-18 |
| 10680415 | ESD protection device and method for manufacturing the same | Hiromitsu Hongo, Takahiro Sumi, Takeshi Miki, Jun Adachi, Takayuki Tsukizawa | 2020-06-09 |
| 10600736 | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods | Yusheng LIN, Shinzo Ishibe | 2020-03-24 |
| 10535585 | Integrated passive device and fabrication method using a last through-substrate via | Hideyuki Inotsume, Kazuo Okada | 2020-01-14 |