Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700018 | Reinforced semiconductor die and related methods | Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR | 2020-06-30 |
| 10546798 | Direct bonded copper semiconductor packages and related methods | Vernal Raja Manikam, Azhar Aripin | 2020-01-28 |