Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651124 | Semiconductor package and related methods | Yusheng LIN, Yenting Wen | 2020-05-12 |
| 10535623 | Wire bonding systems and related methods | Wentao Qin, Gordon M. Grivna, Harold Anderson, Thomas A. Anderson | 2020-01-14 |