Issued Patents 2020
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854516 | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus | Hou Nion Chan | 2020-12-01 |
| 10833154 | Electronic device including an insulating structure | Steven M. Etter, Hiroyuki Suzuki, Miki Ichiyanagi, Toshihiro Hachiyanagi | 2020-11-10 |
| 10804296 | Semiconductor device and method including a conductive member within a trench | Jefferson W. Hall | 2020-10-13 |
| 10796961 | Method of separating electronic devices having a back layer and apparatus | — | 2020-10-06 |
| 10784140 | Electronic device comprising a die comprising a high electron mobility transistor | Ali Salih | 2020-09-22 |
| 10770350 | Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate | — | 2020-09-08 |
| 10741447 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2020-08-11 |
| 10727188 | Semiconductor device and method of forming backside openings for an ultra-thin semiconductor die | — | 2020-07-28 |
| 10727326 | Trench-gate insulated-gate bipolar transistors (IGBTs) | Meng-Chia Lee, Ralph N. Wall, Mingjiao Liu, Shamsul Arefin Khan | 2020-07-28 |
| 10707060 | Method and apparatus for plasma dicing a semi-conductor wafer | Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin +1 more | 2020-07-07 |
| 10672607 | Semiconductor device and method for supporting ultra-thin semiconductor die | Stephen St. Germain | 2020-06-02 |
| 10643852 | Process of forming an electronic device including exposing a substrate to an oxidizing ambient | Peter A. Burke, James Kimball | 2020-05-05 |
| 10593774 | Electronic device including a dielectric layer having a non-uniform thickness | Gary H. Loechelt | 2020-03-17 |
| 10573557 | Method and apparatus for plasma dicing a semi-conductor wafer | David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman | 2020-02-25 |
| 10553491 | Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates | — | 2020-02-04 |
| 10545055 | Electronic device including a temperature sensor | Jaume Roig-Guitart, Herbert De Vleeschouwer | 2020-01-28 |
| 10535623 | Wire bonding systems and related methods | Wentao Qin, Harold Anderson, Thomas A. Anderson, George Chang | 2020-01-14 |
| 10535630 | Semiconductor device and method of forming WLCSP | — | 2020-01-14 |