Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685850 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2020-06-16 |
| 10672693 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Stephen Andrew Smith, Michael J. Hill +1 more | 2020-06-02 |
| 10658765 | Edge-firing antenna walls built into substrate | Sanka Ganesan, William J. Lambert, Debendra Mallik, Zhichao Zhang | 2020-05-19 |
| 10624213 | Asymmetric electronic substrate and method of manufacture | Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Sriram Srinivasan | 2020-04-14 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more | 2020-02-04 |