Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797000 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2020-10-06 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2020-08-11 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2020-06-02 |
| 10595409 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, John S. Guzek | 2020-03-17 |