Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10678137 | Multi-pass patterning using nonreflecting radiation lithography on an underlying grating | Todd R. Younkin, Sang Hun Lee, Charles H. Wallace | 2020-06-09 |
| 10665499 | Integrated circuit with airgaps to control capacitance | Miriam Reshotko, Nafees Kabir | 2020-05-26 |
| 10643946 | Nitrogen assisted oxide gapfill | Sudipto Naskar, Kevin Lin, Ryan Pearce | 2020-05-05 |
| 10559529 | Pitch division patterning approaches with increased overlay margin for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Charles H. Wallace, Leonard P. GULER, Paul A. Nyhus | 2020-02-11 |
| 10553532 | Structure and method to self align via to top and bottom of tight pitch metal interconnect layers | Richard E. Schenker, Robert L. Bristol, Mauro J. Kobrinsky, Kevin Lin | 2020-02-04 |
| 10546772 | Self-aligned via below subtractively patterned interconnect | Richard E. Schenker, Hui Jae Yoo, Kevin Lin, Jasmeet S. Chawla, Stephanie A. Bojarski +3 more | 2020-01-28 |
| 10535601 | Via blocking layer | Rami Hourani, Marie Krysak, Florian Gstrein, Ruth A. Brain, Mark Bohr | 2020-01-14 |