Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Stefan Meister, Myra McDonnell, Chytra Pawashe, Daniel Pantuso | 2020-07-07 |
| 10546772 | Self-aligned via below subtractively patterned interconnect | Manish Chandhok, Richard E. Schenker, Hui Jae Yoo, Kevin Lin, Stephanie A. Bojarski +3 more | 2020-01-28 |