Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825752 | Integrated thermoelectric cooling | Lei Jiang, Edwin B. Ramayya, Rafael Rios, Kelin J. Kuhn, Seiyon Kim | 2020-11-03 |
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Myra McDonnell, Brennen Mueller, Chytra Pawashe, Paul B. Fischer +2 more | 2020-07-21 |
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Myra McDonnell, Chytra Pawashe | 2020-07-07 |