Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Brennen Mueller, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more | 2020-07-21 | $33,796,000 |
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Chytra Pawashe, Daniel Pantuso | 2020-07-07 | $29,601,000 |