Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Brennen Mueller, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more | 2020-07-21 |
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Chytra Pawashe, Daniel Pantuso | 2020-07-07 |