Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10775561 | Optoelectronic component | Hanjo Rhee, Christoph THEISS, Sebastian Kupijai | 2020-09-15 |
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Jasmeet S. Chawla, Myra McDonnell, Chytra Pawashe, Daniel Pantuso | 2020-07-07 |
| 10598859 | Optoelectronic component | Hanjo Rhee, Christoph THEISS, Aws Al-Saadi | 2020-03-24 |