| 10678137 |
Multi-pass patterning using nonreflecting radiation lithography on an underlying grating |
Todd R. Younkin, Sang Hun Lee, Charles H. Wallace |
2020-06-09 |
| 10665499 |
Integrated circuit with airgaps to control capacitance |
Miriam Reshotko, Nafees Kabir |
2020-05-26 |
| 10643946 |
Nitrogen assisted oxide gapfill |
Sudipto Naskar, Kevin Lin, Ryan Pearce |
2020-05-05 |
| 10559529 |
Pitch division patterning approaches with increased overlay margin for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Charles H. Wallace, Leonard P. GULER, Paul A. Nyhus |
2020-02-11 |
| 10553532 |
Structure and method to self align via to top and bottom of tight pitch metal interconnect layers |
Richard E. Schenker, Robert L. Bristol, Mauro J. Kobrinsky, Kevin Lin |
2020-02-04 |
| 10546772 |
Self-aligned via below subtractively patterned interconnect |
Richard E. Schenker, Hui Jae Yoo, Kevin Lin, Jasmeet S. Chawla, Stephanie A. Bojarski +3 more |
2020-01-28 |
| 10535601 |
Via blocking layer |
Rami Hourani, Marie Krysak, Florian Gstrein, Ruth A. Brain, Mark Bohr |
2020-01-14 |