Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10835156 | Thermal tags for real-time activity monitoring and methods for fabricating the same | Jui-Hsin Lai | 2020-11-17 |
| 10833048 | Nanowire enabled substrate bonding and electrical contact formation | Reinaldo Vega, Hari V. Mallela | 2020-11-10 |
| 10811413 | Multi-threshold vertical FETs with common gates | Takashi Ando, Reinaldo Vega, Choonghyun Lee, Hari V. Mallela | 2020-10-20 |
| 10811305 | Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management | John U. Knickerbocker, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb | 2020-10-20 |
| 10770512 | Stacked resistive random access memory with integrated access transistor and high density layout | Reinaldo Vega, Takashi Ando, Hari V. Mallela | 2020-09-08 |
| 10740667 | Temperature triggered switch | Jae-Woong Nah | 2020-08-11 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2020-06-09 |
| 10658182 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker | 2020-05-19 |
| 10651134 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Jeffrey D. Gelorme, John U. Knickerbocker | 2020-05-12 |
| 10651036 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker | 2020-05-12 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10579583 | True random generator (TRNG) in ML accelerators for NN dropout and initialization | Chia-Yu Chen, Pierce I-Jen Chuang, Jui-Hsin Lai | 2020-03-03 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, John U. Knickerbocker, Jae-Woong Nah | 2020-01-28 |