Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879294 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Ji-Chul Kim, Seung-Yong Cha | 2020-12-29 |
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Kyung Suk Oh, Hwa-il Jin, Dong Kwan Kim, Yeong Seok Kim +1 more | 2020-12-29 |
| 10790213 | Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same | Young-Deuk Kim, Younghoon Hyun | 2020-09-29 |
| 10707196 | Electronic device and method of manufacturing the electronic device | Young-Deuk Kim, Woo Hyun Park | 2020-07-07 |
| 10658266 | Thermoelectric cooling packages and thermal management methods thereof | Jichul Kim, Jin-Kwon Bae, Eunseok Cho | 2020-05-19 |
| 10553513 | Chip structure including heating element | Woo Hyun Park | 2020-02-04 |
| 10546844 | Stack package and method of manufacturing the stack package | Eon Soo Jang, Eun-Hee Jung, Hyon-chol Kim, Byeong-Yeon Cho | 2020-01-28 |
| 10541263 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Ji-Chul Kim, Seung-Yong Cha | 2020-01-21 |