Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Kyung Suk Oh, Dong Kwan Kim, Yeong Seok Kim, Jae Choon Kim +1 more | 2020-12-29 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim +2 more | 2020-10-06 |