Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Kyung Suk Oh, Hwa-il Jin, Yeong Seok Kim, Jae Choon Kim +1 more | 2020-12-29 |
| 10847473 | Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating | Ji-Han Ko, Bo Ram Kang | 2020-11-24 |
| 10590217 | Curable resin composition, method for curing same, and sheet manufactured therefrom | Min Hee Lee | 2020-03-17 |