Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847473 | Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating | Bo Ram Kang, Dong Kwan Kim | 2020-11-24 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more | 2020-10-06 |