Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Kyung Suk Oh, Hwa-il Jin, Dong Kwan Kim, Jae Choon Kim +1 more | 2020-12-29 |
| 10825795 | Method of manufacturing semiconductor devices | — | 2020-11-03 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Kil-Soo Kim, Joung Phil Lee +2 more | 2020-10-06 |
| 10607971 | Semiconductor package | Yun-Hyeok Im, Hee-Seok Lee, Tae Woo KANG, Kyoung Min Lee | 2020-03-31 |